Dip soldering apparatus
US5192014A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1991 |
| Grant date | Mar 9, 1993 |
| Priority date | — |
| Expiry date | Oct 15, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0646
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a dip soldering apparatus, a first scraper blade scrapes the surface of the solder bath before a pot is raised through the surface of the bath, and a second blade then scrapes the surface of solder in the pot when the pot has been lifted through the surface. The blades are swept around in a circle to facilitate operation of the device. A rotary station for feeding components to the soldering apparatus comprises a rotatable table carrying a plurality of pneumatically operated stations to index them sequentially through operating positions. The air supply lines, for pneumatic control and operation of each station, are discrete to the respective operating positions and so it is not necessary to provide a system of supply lines which rotate with the stations. An end of a supply line is sealed to a conduit in the table by a PTFE sealing member which has an inwardly directed, tapered lip. As air pressure in the line is increased (to operate the station) the lip is urged against the underside of the table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.