Manufacturing method for thin semiconductor device assemblies
US5192682A · kind A · utility
20Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 1991 |
| Grant date | Mar 9, 1993 |
| Priority date | — |
| Expiry date | May 10, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method for a thin semiconductor device assembly includes forming an internal frame for positioning an IC module within an external frame that forms the periphery of the thin semiconductor device assembly, positioning the IC module in the internal frame so that an electrode terminal surface of the IC module is exposed, and fixing the IC module in place by filling the external and internal frames with resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.