Plastic packaged semiconductor device
US5193053A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 1991 |
| Grant date | Mar 9, 1993 |
| Priority date | — |
| Expiry date | Oct 23, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plastic semiconductor device has a lead frame provided with an island for received a semiconductor element. A plurality of leads project from a square outer frame and are distributed around the periphery of the island. An insulating substrate covers and is bonded to one principal surface of the island while exposing the semiconductor element. Distributing wires are formed on one principal surface of the insulating substrate to conform with the leads. A conductive substance connects the distributing wires to the leads and fills any through-holes formed in the insulating substrate. Bonding wires connect input-output terminals of the semiconductor element to the leads. A resin body encloses and embeds the bonding wires and the semiconductor element. A heat sink may be bonded to the back face of the island.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.