Method for joining a conductor track foil to an electrical component
US5193270A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1991 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Nov 6, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/748
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for attaining a tolerance-insensitive connection of a conductor track foil with contact pins of an electrical component. The conductor track foil includes two insulating layers with an intervening conducting layer with lands in the upper layer for soldering the conductive layer to the contact pins of the electrical component. The conductor track foil is lowered, positionally correctly, onto the electrical component by use of a mounting device. The bottom insulating layer and the conducting layer of the soldering lands, which are free of an insulating layer on the top, are pierced by the contact pins extending at right angles to the conductor track foil. The conductor track foil is released by the mounting apparatus. A soldered connection is made between the lands and the contact pins. As a result, an electrically reliably gap free conducting connection is attainable even if the contact pins are eccentrically associated with the soldering lands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.