Leadwire attachment technique for manufacturing a thin film sensor and a sensor made by that technique
US5193402A · kind A · utility
4Cited by
2References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 21, 1992 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Jan 21, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a sensor with an attached leadwire (10) fastened to an adaptor block (18) which is attached to a gage shim (24). The sensor is deposited on an insulated layer (28) placed on the gage shim (24) in electrical contact with the electrical leads (16) of the leadwire (10). One or more passivation layers (36) are applied over the upper surface of the entire sensor to provide a complete seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.