Jet solder bath
US5193734A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jan 22, 1992 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Jan 22, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0653
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A jet solder bath is comprised of a bath unit which contains a molten solder, a nozzle member provided within the bath unit and constructing a nozzle mouth, a tank provided in at least one side of the nozzle member along the nozzle mouth and temporarily accumulating a solder jetted from the nozzle mouth, and a molten solder outlet provided on the lower portion of the tank and communicating the tank with a molten solder still area provided within the solder bath unit under the liquid level of the molten solder. According to the above-mentioned arrangement, the molten solder can be suppressed from being oxidized as much as possible and the removal of a resultant oxide can be facilitated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.