Methods and apparatus for soldering without using flux
US5193738A · kind A · utility
51Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 18, 1992 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Sep 18, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Metallic surfaces are soldered together without using flux or solvents. The metallic surfaces are maintained in an atmosphere of inert gas and cleaned with a laser. An ejection device deposits drops of liquid solder on a predetermined one of the metallic surfaces and the metallic surfaces are moved relative to each other so that the solidified solder contacts the other metallic surface. The metallic surfaces and the solidified solder are then heated until the solidified solder reflows and joins the metallic surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.