Acrylate-based hot-melt pressure-sensitive adhesives

US5194455A · kind A · utility

Assignee

• BEIERSDORF AG · DE

Inventors

• Klaus Massow · Hamburg, DE
• Werner Karmann · Hamburg, DE
• Gunther Kiessling · Hamburg, DE

Key dates

• Filing date: Dec 14, 1990
• Grant date: Mar 16, 1993
• Expiry date: Dec 14, 2010

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/2891
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The invention relates to a process for the preparation of acrylate-based pressure-sensitive hot-melt adhesives by irradiation on a substrate, characterized in that PA1 a) at least one acrylic monomer is copolymerized with N-tert.-butylacrylamide (TBA), wherein PA1 b) the reaction mixture (of a) to be polymerized can additionally contain one or more ethylenically unsaturated compounds which do not belong to the group of acrylic monomers of a), PA1 c) the resulting solid polymer is heated and is applied in a form which is capable of flowing or a liquid form to a substrate, it being possible for the compositions of steps a) to c) to contain additives and auxiliaries if appropriate, and PA1 d) the coated substrate is irradiated with high-energy radiation.