Thermoplastic semiconductor package
US5194695A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 2, 1990 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Nov 2, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a lead frame with a die or chip mounted on a die pad, a base made of a thermoplastic material and having a cavity, and a lid made of thermoplastic material ultrasonically welded to the base to cover the cavity and protect the electronic device in the package. The package may include a substrate with conductive traces. A method of attaching a lid to a semiconductor package base includes the steps of providing a semiconductor package base having an open cavity, providing a thermoplastic lid that covers the open cavity, placing the lid on the semiconductor package base so that the lid covers the open cavity, applying pressure to hold the lid and body together, and attaching the lid to the base by ultrasoncially welding them together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.