Electrically conductive feedthrough connection and methods of manufacturing same
US5194697A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1990 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Mar 20, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10303
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mechanically heavily loadable and high-vacuum-tight feedthrough connection through a hole (2) of a high-temperature-resistant and vacuum-proof insulating part (1), particularly of ceramic, glass, or a single crystal, is disclosed which can be produced in a single high-temperature step and is thus inexpensive. It is designed as a terminal lead (4) covered with active solder and soldered into the hole, the terminal lead having a coefficient of thermal expansion less than that of the insulating part (1). The feedthrough connection is preferably used in a capacitive pressure sensor (10) having a diaphragm (11) and a substrate (12) which have spaced-apart, flat inner surfaces which are provided with at least one conductive layer (14, 15) for forming at least one capacitor and are electrically connected to the respective rear side via the feedthrough connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.