Method and apparatus for laser masking of lead bonding
US5194710A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 1991 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | May 22, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method of making a beam of directed energy used to bond leads to bonding areas is disclosed. The masking tool preferably includes a groove adapted to allow the beam to strike the lead while masking the surrounding substrate to prevent damage to it. The tool preferably reflects the energy striking it away from the substrate. The method can include the use of an external heat source to provide heat to the bonding process or, in the alternative, provide heat sinking to protect the electrical components from heat damage. Alternate embodiments of the tool can include a plurality of grooves or slots to allow scanning of the beam in the bonding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.