Cutting using high energy radiation
US5194711A · kind A · utility
5Cited by
8References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 10, 1991 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Apr 10, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/364
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In order to make a laser cut in a diamond (1), the diamond (1) is reciprocated transversely, the radiation is focussed onto the bottom of the cut (6) by a stationary focussing lens (4 ), and the radiation is passed to the focussing lens (4) by a mirror (3) which is reciprocated in the same direction as the diamond (1), thereby rocking the axis (5) of the beam below the lens (4). This increases the energy entering the cut and reduces the focal spot area projected on the cut wall, thus increasing the energy density of radiation on the inclined cut walls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.