Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer
US5195020A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1991 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Nov 1, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling system used with a printed circuit board has at least a solid circuit component thereon. The cooling system comprises a cooling header and cooling modules connected to the cooling header. Each of the cooling modules engage to each of the components. The cooling module has a heat transfer plate connected to one end of a bellows which is connected to the cooling header at the other end. A layer of thermally conductive compound, such as a layer of thermal grease, is interposed between the heat transfer plate and the corresponding circuit component. The thermally conductive layer is initially pressed with a pressure higher than a critical pressure, and thereafter, the pressure is reduced to a working pressure exerted on the circuit component provided by the resilient force of the bellows and the hydraulic pressure of the coolant. The critical pressure is predetermined experimentally or practically. As the result, the thermal contact resistance between the heat transfer plate and the circuit component is favorably reduced and stabilized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.