Integrated circuit package with strain relief grooves
US5195023A · kind A · utility
70Cited by
1References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1991 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Dec 23, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
As the size and consequent thickness of IC packages shrink bowing of the package due to differential contractions becomes a problem. The solution according to this invention is to mold strain relief grooves into the surface of the plastic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.