Temperature controlled laser diode package
US5195102A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1991 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Sep 13, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02484
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention temperature controlled package comprises a case having sidewalls that form a closed perimeter; a cover; and a base having an input surface and an output surface. The sidewalls are integrally coupled to the base input surface to define an interior region. A heatsink has a top surface and a bottom surface. The heatsink bottom surface is attached to the input surface of a thermoelectric cooler. The bottom surface of the thermoelectric cooler is coupled to the base input surface of the case. The thermoelectric cooler responds to a control signal to move heat from the thermoelectric cooler input surface to the thermoelectric cooler output surface. In a first alternative embodiment, a laser diode coupled to the heat sink responds to an electrical input signal to providing an optical laser output signal. The optical output of the laser diode is coupled via a optical fiber through a fiberoptic feedthrough in a sidewall. The interior region is filled with xenon gas. A cover is welded on the sidewalls to form a sealed interior region with xenon gas therein. The xenon gas limits the movement of heat from the interior surface of the sidewalls and the interior surface of the cover…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.