Peroxide composition for removing organic contaminants and method of using same
US5196134A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 17, 1992 |
| Grant date | Mar 23, 1993 |
| Priority date | — |
| Expiry date | Aug 17, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/26
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition for removing organic contaminants, such a flux residues, from a solid substrate comprises: (a) hydrogen peroxide in the amount of about 3 to 5 percent by weight of the composition; (b) an alkaline compound in sufficient amount to provide a pH of at least 10.5 in the composition; (c) about 0.1 to 0.3 percent by weight of a chosen wetting agent which is unreactive with the hydrogen peroxide and the alkaline compound; and (d) purified water as the balance of the composition. Optionally, the composition may further comprise about 0.5 to 2.0 percent by weight of a chosen metal protective agent. The solid substrate having organic contaminants thereon is exposed to the above-noted composition whereby the organic contaminants are removed from the substrate and are converted into non-toxic and non-hazardous products. Thus, negative environmental impact is avoided by the present process. In an alternative embodiment, the organic contaminant removal is further enhanced by exposing the composition and the organic contaminants on the substrate to ultraviolet radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.