Meltblown die head
US5196207A · kind A · utility
18Cited by
26References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 27, 1992 |
| Grant date | Mar 23, 1993 |
| Priority date | — |
| Expiry date | Jan 27, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C48/865
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There is disclosed a meltblown die head having a heated gas reservoir extending the length of the die head. The heated gas used in the meltblowing process is introduced into the reservoir and serves as a heat source for maintaining the temperature of the polymer and maintaining a uniform temperature of the die assembly during the meltblowing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.