Wireless electrical connections of abutting tiled arrays
US5196652A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 1990 |
| Grant date | Mar 23, 1993 |
| Priority date | — |
| Expiry date | Dec 26, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for electrically connecting planar element substrates (12) to form an array (10) by forming conductive bridges (16) between metal pads (14) located on the surface of array elements (12). These bridges (16) are designed to transmit or receive visual, acoustical or other electromagnetic data and power. The conductive bridges (16) are formed to be nearly coplanar with the planar elements (12) and are made to connect the edges (14b) of pads (14) which are fused to the planar substrate (12). Metal wire (16a), solder (16b-c), a conductive polymer (16d), or a suspension of conductive particles in paste (16e) are used to bridge and electrically connect the pads (14) located on the array elements (12). The bridges (16) have a low profile, occupy a very small area and reduce the need for highly accurate alignment of adjacent substrates (12) within the tiled array (10) before electrical connections are formed. These low profile bridges (16) are especially advantageous in that they allow a protective plastic or similar cover sheet, or a liquid crystal laminate to be surface mounted on the composite array (10) without causing detrimental surface blemishes or ridges. The small area of t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.