Laser processing arrangement
US5196672A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1992 |
| Grant date | Mar 23, 1993 |
| Priority date | — |
| Expiry date | Feb 25, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/064
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing arrangement includes a laser oscillator which outputs a laser beam. The laser beam path is established such that the beam reflects from a flat surfaced mirror to a concave mirror and then to a second concave mirror before irradiating a work piece under processing. The arrangement further includes a temperature sensor associated with a temperature detecting means. The temperature detecting means is connected to a control unit which controls moving means connected to movable axes of a processing surface in order to move the work piece relative the laser beam. The control unit is further effective to control the laser oscillator according to a desired temperature range for processing. The temperature sensor is preferably positioned within 45.degree. of the laser beam and the angle of incidence of the laser beam is selected so as to be smaller than a brewster angle of the material of the work piece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.