Foaming flux for automatic soldering process
US5198038A · kind A · utility
1Cited by
28References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1991 |
| Grant date | Mar 30, 1993 |
| Priority date | — |
| Expiry date | Oct 21, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3618
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A non-toxic, non-corrosive foaming soldering flux (14) comprises citric acid and water, together with at least one foaming agent. The foam is fast-breaking, dissipating almost immediately. Such a fast-breaking foam is novel in an aqueous-based flux. The unique flux of the invention produces solder joints of high metallic luster and excellent quality. Disposal presents no health hazards, and clean-up of flux residues is accomplished using only water and, optionally, a surfactant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.