Heat-sensitive stencil sheet
US5198407A · kind A · utility
10Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1990 |
| Grant date | Mar 30, 1993 |
| Priority date | — |
| Expiry date | Jun 1, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41N1/242
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A heat-sensitive stencil sheet is disclosed, which comprises a porous sheet having on one side thereof at least an adhesive layer and a thermoplastic resin film layer in this order, wherein at least one of the layers constituting said stencil sheet contains a heat-sensitive color-forming material. The layer containing the heat-sensitive color-forming material develops a color on thermal perforation to visualize the perforated image so that a printing ink, particularly plural inks of different color, can be easily applied to the stencil sheet in proper positions in proper quantities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.