Moisture-curing acrylate/epoxy hybrid adhesives
US5198524A · kind A · utility
16Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1991 |
| Grant date | Mar 30, 1993 |
| Priority date | — |
| Expiry date | Apr 22, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive composition for adhering two substrates includes a mixture of acrylate and epoxy with a tri- or tetrafunctional ketimine as a curing agent. The adhesive composition provides a two-stage cure in which, in a first stage, the adhesive is moisture cured at ambient temperature to provide green strength. In a second stage, the adhesive is post-cured at elevated temperatures to provide a high strength bond. The ketimine is formed form the reaction of diisopropyl ketone and an amine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.