Semiconductor device having an improved lead arrangement and method for manufacturing the same
US5198883A · kind A · utility
24Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1989 |
| Grant date | Mar 30, 1993 |
| Priority date | — |
| Expiry date | Jul 19, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
First and second frame bodies are used to fabricate a semiconductor device. The first frame body includes a die pad. The second frame body only includes a plurality of leads. The die pad is depressed by a predetermined amount which is equal or greater than the thickness of a semiconductor chip to be mounted on the die pad. The two frame bodies are welded, and wire bonding and cutting of the leads are performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.