Ceramic base power package
US5198885A · kind A · utility
15Cited by
11References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 16, 1991 |
| Grant date | Mar 30, 1993 |
| Priority date | — |
| Expiry date | May 16, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high power, hermetic, low cost, high reliability package for electrical devices is described. The package includes in the preferred embodiment an aluminum nitride substrate, copper thick film ink screen printed and fired upon the substrate, a Kovar ring brazed to the copper thick film ink, a thermally dissipating device mounted, the device bonded to electrical feed-throughs that pass through the Kovar ring, and a cover bonded to said Kovar ring to form an additional part of the hermetic seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.