Semiconductor stacked device
US5198888A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Dec 20, 1990 |
| Grant date | Mar 30, 1993 |
| Priority date | — |
| Expiry date | Dec 20, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/363
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.