Metal transfer layers for parallel processing
US5199163A · kind A · utility
29Cited by
21References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1992 |
| Grant date | Apr 6, 1993 |
| Priority date | — |
| Expiry date | Jun 1, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure and process for forming dense multi-layer thin film structures wherein individual layers of thin film wiring which can be pre-inspected and then laminated one on top of the next to form a three dimensional wiring matrix are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.