Exterior lead forming device for semiconductor devices
US5199469A · kind A · utility
2Cited by
3References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 29, 1991 |
| Grant date | Apr 6, 1993 |
| Priority date | — |
| Expiry date | Aug 29, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An exterior lead forming device for semiconductor devices includes a pair of roller holders rotatably attached to a punch plate. When the punch plate is lowered, the leads of a semiconductor device fixedly held on a bending die by a pressing plate are bent along the sides of the bending die. The paths of the bending rollers are monitored by a camera and path errors, calculated by a comparator, are fed back to a motor control circuit to adjust the positions of bending roller guide plates and thereby correct the path errors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.