Semiconductor device, its fabrication method and molding apparatus used therefor
US5200366A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1991 |
| Grant date | Apr 6, 1993 |
| Priority date | — |
| Expiry date | Apr 26, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a resin mold semiconductor device in which a chip is mounted to a substrate and one of its main planes is molded by a resin member by pressure molding, and in a molding apparatus therefor, a gate of a mold is formed in such a manner as to extend towards a radial center of wires inside a cavity so that the resin injected under pressure from a gate of the molding apparatus into the cavity flows in a radial direction along the wires and air vents are opened at the remotest positions of the cavity from the gate. Accordingly, there can be obtained a semiconductor device in which a gate trace is positioned on the upper surface of the resin member and on a vertical line passing through the radial center of leads formed radially on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.