Thermoplastic molding compositions based on polyamide

US5200450A · kind A · utility

Assignee

• BASF SE

Inventors

• Gerd Blinne · Worms, DE
• Walter Goetz · Ludwigshafen, DE
• James Hurley · Mannheim, DE
• Herbert Gutsche · Kaiserslautern, DE
• Klaus Muehlbach · Havelsee, DE

Key dates

• Filing date: Oct 1, 1991
• Grant date: Apr 6, 1993
• Expiry date: Oct 1, 2011

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L77/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The thermoplastic molding compositions contain as essential components PA1 A) from 96 to 99.9% by weight of at least one polyamide, PA1 B) from 0.1 to 4% by weight of one or more dialkyl ketones of the general formula I ##STR1## where R and R' are each alkyl of from 10 to 30 carbon atoms, and also, based on the sum total of A) and B), PA1 C) from 0 to 40% by weight of an impact modifying rubber, PA1 D) from 0 to 60% by weight of fibrous or particulate fillers or a mixture thereof, and PA1 E) from 0 to 120% by weight of a modified polyphenylene ether.