Patent · US Expired

Resistor structure and method of fabrication

US5200733A · kind A · utility

18Cited by
4References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 1, 1991
Grant dateApr 6, 1993
Priority date
Expiry dateOct 1, 2011

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A resistor in an integrated circuit having a conductive shield layer between the resistor and an insulative layer. The contacts of the resistor may also contact the conductive shield layer. The shield layer may be formed during a single or double level polysilicon bipolar transistor fabrication process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.