Three dimensional microstrip patch antenna
US5200756A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 3, 1991 |
| Grant date | Apr 6, 1993 |
| Priority date | — |
| Expiry date | May 3, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/0428
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna assembly comprises a dome-like substrate with a ground plane layer on the interior surface of the substrate and a radiative patch on the outer surface of the substrate. The cavity defined by the substrate is closed off by a base having a conductive layer that is connected to the ground plane layer, thereby to isolate the cavity and circuit elements that may be disposed therein. Preferably the substrate has a polyhedral form and the radiative patch is a polygon having apex portions that extend down over the side surface of the substrate to enhance the sensitivity of the antenna at low elevations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.