Non-tacky hot melt adhesive containing package
US5201420A · kind A · utility
6Cited by
18References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 1992 |
| Grant date | Apr 13, 1993 |
| Priority date | — |
| Expiry date | May 21, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S206/813
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A tackless hot melt adhesive package is provided by using a hydrogenated castor oil coating material and a low pressure, melt blow application technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.