Apparatus for making insert molded circuitry
US5203060A · kind A · utility
16Cited by
2References
6Claims
0Family size
Inventors
Key dates
| Filing date | Jan 15, 1992 |
| Grant date | Apr 20, 1993 |
| Priority date | — |
| Expiry date | Jan 15, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5193
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for forming insert molded circuits. The process includes inserting a circuit network comprised of a lace curtain with a plurality of individual circuits which are connected by interconnect members into a mold and then separating the individual circuits in the mold by cutting the interconnect members while the lace curtain is in the mold. After the interconnect members have been severed, plastic is injected into the mold thereby surrounding the individual traces. A mold for performing the process is disclosed which includes a retractable punch arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.