Method for mounting large discrete electronic components
US5203077A · kind A · utility
3Cited by
5References
5Claims
0Family size
Inventor
Key dates
| Filing date | Sep 11, 1991 |
| Grant date | Apr 20, 1993 |
| Priority date | — |
| Expiry date | Sep 11, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting device and method are provided for mounting of large discrete electronic components such as transformers on a surface mount circuit board. A carrier board is provided with small tabs extending laterally outwardly therefrom and the lead wires from the component are wrapped around the tabs. Corresponding solder pads are provided in the main circuit board so as to coincide with the tabs. The solder on the pads is flowed to secure the carrier to the main board in good electrical and mechanical contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.