Reflow soldering method and system therefor
US5203487A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1992 |
| Grant date | Apr 20, 1993 |
| Priority date | — |
| Expiry date | Mar 25, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a method and a system in which while carrying objects to be treated to a preheating chamber and a reflow chamber adjacent thereto, hot gases are blown against the objects to be treated by cross flow blowers provided in the preheating chamber and the reflow chamber to melt solder so as to solder electronic parts on a circuit substrate; a free air introducing port is controllably provided in the vicinity of an intake port of the cross flow blower in the preheating chamber, and an exhaust port and an exhaust fan for exhausting gases having an amount corresponding to the free air taken from the free air introducing port, out of the preheating chamber are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.