Die presentation system for die bonder
US5203659A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1992 |
| Grant date | Apr 20, 1993 |
| Priority date | — |
| Expiry date | Jun 2, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die presentation package exchange system for use in a hybrid die bonder, in particular an automatic hybrid die bonder, which system comprises a magazine (10) for storing a plurality of die presentation packages (12). The system further comprises a clamp assembly (40), adapted to collect a selected die presentation package (12) from the magazine (10) and feed it to a die eject station (204) of the die bonding machine. The clamp assembly (40) is further adapted to retrieve the die presentation package (12) from the die eject station (204) after a predetermined number of dice have been ejected, and return it to the magazine (10). The magazine (10) further comprises indexing structure for indexing movement of the packages (12) within the magazine (10) so that the selected package is located at a collection point for collection from the magazine (10). The system further comprises indexing structure for indexing rotation of the clamp assembly (40) about its axis (62). The die presentation package exchange system makes it possible to change from one die presentation package to another with minimum delay, and consequently minimum loss in production time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.