Controlled electroless plating
US5203911A · kind A · utility
256Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1991 |
| Grant date | Apr 20, 1993 |
| Priority date | — |
| Expiry date | Jun 24, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.