Method for etching an organic polymeric material

US5203955A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Aldred Viehbeck · Stormville, US
• Stephen L. Buchwalter · Hopewell Junction, US
• John J. Glenning · Vestal, US
• Martin J. Goldberg · Saratoga, US
• Caroline A. Kovac · Ridgefield, US
• Linda C. Matthew · Peekskill, US
• Walter P. Pawlowski · Endicott, US
• Stephen L. Tisdale · Vestal, US

Key dates

• Filing date: May 24, 1991
• Grant date: Apr 20, 1993
• Expiry date: May 24, 2011

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D5/022
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.