Photosensitive resin composition
US5204218A · kind A · utility
8Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1991 |
| Grant date | Apr 20, 1993 |
| Priority date | — |
| Expiry date | Jun 17, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0045
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed herein is a photosensitive resin composition containing: PA1 a photobase generator expressed in the following general formula (I): ##STR1## where R.sub.1, R.sub.2 and R.sub.3 are individually selected from the group consisting of hydrogen, halogen, alkyl groups, alkenyl groups, alkinyl groups, phenyl groups and alkoxy groups; and PA1 a base-catalytic reaction compound which is cured or decomposed under basic conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.