Photosensitive resin composition
US5204221A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1991 |
| Grant date | Apr 20, 1993 |
| Priority date | — |
| Expiry date | Jan 31, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0076
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a photosensitive resin composition which has improved water developability and storage stability. The composition comprises PA0 (I) crosslinked resin particles prepared by a post-emulsion method from PA1 (a) a base resin having a glass transition temperature (Tg) of 0.degree. C. or less and a polymerizable double bond, PA1 (b) a monomer which, when polymerized, provides a resin in which Tg is 20.degree. C. higher than that of the base resin, or a resin in which Tg is 20.degree. C. higher than that of the base resin, PA1 (c) a polyvinyl compound, and PA1 (d) a polymerization initiator PA0 (II) a photopolymerizable unsaturated monomer, and PA0 (III) a photopolymerization initiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.