Acrylic-modified epoxy resin adhesive compositions with improved rheological control
US5204386A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1992 |
| Grant date | Apr 20, 1993 |
| Priority date | — |
| Expiry date | Jun 9, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/922
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thixoropic adhesive composition exhibiing good sag resistance is prepared comprising a mixture of a polymer-modified epoxy resin and a rheological control agent. The polymer-modified epoxy resin is preferably a dispersion of acrylic elastomer in an epoxy resin in which the acrylic elastomer particles have added hydroxyl functionality which interacts favorably with rheological control agents, such as fumed silica. Acrylic epoxy resin dispersions containing added hydroxyl functionality give improved rheological control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.