Thermoplastic film die attach adhesives
US5204399A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 9, 1991 |
| Grant date | Apr 20, 1993 |
| Priority date | — |
| Expiry date | Aug 9, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This is a thermally conductive adhesive having excellent die shear strength, in film form, and having a weight average molecular weight of about 100,000 to 150,000, prepared from a mixture of a dietherdianhydride, a meta-substituted benzenediamine, a polysiloanediamine, and a thermally conductive filler, that is suitable as a die attach adhesive: it bonds rapidly without the need for curing or baking off-line; does not produce excess stress on the die; requires no refrigeration; provides uniform bond line thickness between the die and paddle; can be used at temperatures that do not oxidize copper lead frames or produce excessive thermal stress; can be reworked; and can exert adequate adhesion during the processes of wire bonding and molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.