Optical interconnection of circuit packs
US5204925A · kind A · utility
114Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1991 |
| Grant date | Apr 20, 1993 |
| Priority date | — |
| Expiry date | Sep 11, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3878
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is an apparatus for the optical interconnection of circuit packs and components mounted on circuit packs, and a method of manufacture. Optical fibers are bonded to a flexible substrate. The substrate includes tabs that can be terminated by standard V-groove silicon chip connectors for optical connection to the edges of circuit packs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.