Electronic parts mounting apparatus
US5205032A · kind A · utility
55Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1991 |
| Grant date | Apr 27, 1993 |
| Priority date | — |
| Expiry date | Sep 27, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic parts mounting device according to this invention is characterized by including a mount body which is obtained by bonding at least two substrates each having a predetermined thicknesses and a smooth surface and which has at least one bonding portion, the mount body having at least one recessed portion selectively formed in one exposed surface of the mount body to reach the bonding portion, and the recessed portion having a tapered shape widened from the bonding portion to the exposed surface, and an electronic part mounted in the recessed portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.