High density parallel interconnect
US5205739A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1992 |
| Grant date | Apr 27, 1993 |
| Priority date | — |
| Expiry date | Apr 2, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/774
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A modified high density backplane (MHDB) connector is provided for electrically interconnecting high density printed circuit boards having predetermined interconnect circuitry including high density arrays of ground/signal contact pads, discrete power pads and discrete ground pads. The MHDB connector includes one or more contact modules, a connector housing, a pcb biasing mechanism, connector end caps, a flexible film, two interactive biasing modules for each contact module, and a camming member secured to the pcb to be mated. The interactive biasing modules contact with the flexible film to provide uniform contact force distribution over the interconnect regions of the connector and provide contact rivet displacement tolerance relief. The MHDB connector provides sequenced movement of the pcb to be mated into the contact rivets to provide contact wipe and may provide for alignment of the one pcb with the MHDB connector. The end caps provide for MHDB connector sealing and localized securement of the connector to the pcb. The power contact modules may include supply and return contacts and provide the capability for reconfiguring the MHDB connector for diverse applications. A paralle…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.