Temperature compensating strain relief connection for flexible electrical circuits
US5205750A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1991 |
| Grant date | Apr 27, 1993 |
| Priority date | — |
| Expiry date | Dec 6, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure and method for mounting a flexible electrical circuit to rigid substrate to effect electrical connection between contacts on one side of the flexible electrical circuit with electrical pads on one side of the substrate is provided. The connection allows for strain relief due to mechanical stress, as well as compensating for thermally induced stress. The structure includes a clamping member disposed to clamp and position the flexible circuit with its one side in face to face relationship with the surface of the substrate. A supporting structure is carried by the substrate and has a mounting member mounting the clamping member to maintain the flexible circuit and the substrate in face to face contacting relationship. The mounting structure also includes a spring mechanism yieldingly responsive to thermal expansion stress which mechanism urges the flexible circuit into contact with the substrate. The invention also includes an assembly tool for aiding in the formation of bonds between the pads and the contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.