Cathode sputtering apparatus
US5205919A · kind A · utility
14Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 20, 1991 |
| Grant date | Apr 27, 1993 |
| Priority date | — |
| Expiry date | Jun 20, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cathode sputtering apparatus for the coating of substrates in a vacuum chamber is presented which accommodates a rotating substrate carrier, and which comprises at least one gripper which includes a hub and at least one arm with a gripper with the hub rotating around a horizontal axis; during the sputtering, two annular closing elements separate a segment in front of the station from the remaining portion of the vacuum chamber and a cathode vacuum chamber is thus formed which is separate from the vacuum chamber of the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.