Light-sensitive composition for use as a soldermask and process
US5206116A · kind A · utility
18Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1991 |
| Grant date | Apr 27, 1993 |
| Priority date | — |
| Expiry date | Mar 4, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/136
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A light sensitive composition and process for using said composition. The light sensitive composition comprises a phenolic resin, a multifunctional epoxy or vinyl compound, a photoinitiator and a thermal crosslinking agent. The process for using the same comprises application of the light sensitive composition to a substrate, drying of the same, exposing the dried coating to activating radiation, partially heat curing the coating, developing the coating and thermally curing the developed image. The composition is especially useful as a solder mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.