Aromatic diamine compounds, bismaleimide compounds, thermosetting resin forming compositions therefrom, resins therefrom, and methods for their preparation
US5206438A · kind A · utility
3Cited by
1References
1Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 23, 1990 |
| Grant date | Apr 27, 1993 |
| Priority date | — |
| Expiry date | Oct 23, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/124
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.