Building block approach to microwave modules
US5206712A · kind A · utility
44Cited by
7References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1990 |
| Grant date | Apr 27, 1993 |
| Priority date | — |
| Expiry date | Apr 5, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microwave components are prepackaged and pretested to provide standard microwave components or subsystems. A dielectric overlay interconnection structure enables accurate testing and rework of out of specification packages. Microwave systems are formed of a plurality of such prepackaged components with a high yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.